We need to make sure we can package the IC after the wafer has been diced into individual dies.

A common way of packaging ICs is to connect them to a leadframe by bonding tiny wires between the leads of the leadframe and the pads on the die.

The big bond pads around the outside of the IC often include ESD protection diodes, Input/Output drivers and so on.

This picture shows raven, an IC from Efabless. You can see around the edge there are the big bond pads and the power and ground lines. This structure is called a padring.

The padring used in the Google shuttle is included in Caravel.

Course feedback

The Zero to ASIC course was great! Through this course I became more proficient with Verilog and started to not just appreciate, but actually enjoy the design verification! It offers the glimpse at the superpower too - seeing the traces of the original design in what used to be just squiggly lines of the masks before. Plus, I am getting my own piece of a silicon 🙂

Renaldas Zioma (digital course)