We need to make sure we can package the IC after the wafer has been diced into individual dies.

A common way of packaging ICs is to connect them to a leadframe by bonding tiny wires between the leads of the leadframe and the pads on the die.

The big bond pads around the outside of the IC often include ESD protection diodes, Input/Output drivers and so on.

This picture shows raven, an IC from Efabless. You can see around the edge there are the big bond pads and the power and ground lines. This structure is called a padring.

The padring used in the Google shuttle is included in Caravel.

Course feedback

The Zero To ASIC course took me on a fantastic journey from drawing and simulating a MOSFET, formal verification leading up to implementing a custom design with an open PDK and completely open source tools. The course is crammed full of interesting material with great pacing and support from Matt, and it's been a fantastic opportunity to meet other folks with shared interests and different backgrounds. The course has left me excited with opportunities for new projects and optimism for some working silicon!

Jamie Iles (digital course)