What is WLCSP packaging?

WLCSP (Wafer Level Chip Scale Packaging) is a very small, cheap IC package where the chip is packaged at the wafer level, without the bond wires used in traditional packaging.

What are the advantages of WLCSP over wire-bonded packages?

WLCSP eliminates bond wires, which reduces parasitic inductance that can cause problems for high-speed designs, while also being smaller and cheaper to produce.

WLCSP

Suggest an improvement

November 13, 2020

This package is very small and cheap to produce. It also has benefits due to the lack of bond wires. Bond wires increase parasitic inductance, and can be a problem for high speed designs.

package

The downside is that they are very tiny!

cross section

The last 5 layers of the Skywater PDK define the layers necessary to build the WLCSP package.

Course feedback

Anybody who wants to learn about ASIC design who's never done it, this was a great introduction. I really enjoyed the course, this has been a great learning experience.

Tom Gwozdz (digital course)