WLCSP
This package is very small and cheap to produce. It also has benefits due to the lack of bond wires. Bond wires increase parasitic inductance, and can be a problem for high speed designs.
The downside is that they are very tiny!
The last 5 layers of the Skywater PDK define the layers necessary to build the WLCSP package.
Course feedback
I've always wanted to make chips of my own since forever, but until this initiative it was unbelievably expensive. So I just needed to acquire the knowledge to do it. I saw you going through the whole thing from RTL to a design and that meant you had the insights for all of it.